Santa Clara, CA – September 2025
The Santa Clara Convention Center once again became the epicenter of next-generation data infrastructure this week as AI Infra 2025 brought together the biggest names in networking, compute, and storage. This year, the joint showcase from ATOP and Linksia, demonstrated their expertise to deliver 1.6 Tbps optical and copper interconnect solutions for AI data centers.
The Buzz Around 1.6T
Walking the show floor, the ATOP | Linksia booth stood out with its bold banner:
“1.6T Optical & Copper Solutions – The Fuel for Efficient & Lighting-Fast AI.”
Their display centered around 1.6T OSFP DR8 SiPh modules, promising to meet the massive bandwidth requirements of AI clusters at lower power and lower latency. For engineers and architects designing next-generation AI fabrics — whether building GB300 racks or fat-tree topologies — the demo resonated deeply.
Linksia and ATOP highlighted its silicon photonics (SiPh) innovation and showcased its copper and fiber transceiver portfolio, giving visitors a full-stack look at connectivity options for AI workloads. Together, they presented a vision of seamless interoperability across copper DACs, AOCs, and high-density optics — a crucial need for balancing cost, reach, and power efficiency in large-scale deployments.
What Made This Collaboration Unique
- Unified Portfolio: Attendees could inquire copper and optical solutions, with detailed specs for latency, reach, and power consumption from optic transceivers (OSFP, QSFP-DD, QSFP112, etc.)
- AI-Optimized Design: The solutions are positioned for training clusters, inference pods, and HPC workloads, with 1.6T modules offering scalable upgrades from today’s 800G deployments.
- Expert Engagement: Engineers from both companies were present to walk visitors through performance metrics, connector options, and network topologies optimized for AI workloads.
The Broader AI Infra 2025 Vibe
The entire convention pulsed with discussions about AI cluster efficiency, rack power density, and fabric scaling. Beyond optics, vendors showcased 800G/1.6T switches, liquid cooling systems, and smart NICs — all critical pieces of the puzzle for building the next wave of AI infrastructure.
ATOP and Linksia’s joint presence sent a strong signal: interconnect innovation will be a cornerstone of AI performance scaling. Our booth was consistently busy, drawing network architects, cloud operators, and system integrators eager to understand how to keep up with the relentless growth of model sizes and bandwidth demands.
Takeaways
AI Infra 2025 made clear that the industry is gearing up for the 1.6T era, and ATOP + Linksia are ready to deliver the building blocks. For more information, please reach out to sales@linksia.com.
